The 2026 CGC Global Chip Micro-Soldering World Cup and GTXPO International Hardware Technology Expo recently concluded successfully. As a leading Chinese brand in electronic soldering and rework tools and the event’s officially designated tool sponsor, BAKON showcased a range of newly developed products, including the BK2601/BK2602/BK2603 Series Multifunctional Desoldering Stations, BK212 Soldering Station, BK210MX Soldering Iron, BK261mini Fume Extractor, and BGA Rework System. Among them, the flagship BK2603 Series underwent hands-on testing by top repair technicians from around the world, earning widespread recognition from competitors and professional visitors alike.
Flagship Products Put to the Test, Core Performance Validated by Experts
The BK2601/BK2602/BK2603 Series represents BAKON’s flagship product lineup for the year, developed for high-end chip repair and precision electronics manufacturing. Powered by BAKON’s proprietary fourth-generation intelligent temperature control algorithm, the series delivers temperature control accuracy of ±0.5°C and millisecond-level temperature recovery, maintaining stable tip temperatures during continuous operation.
Designed to meet the demands of BGA chip rework, the equipment features hot-air nozzles in multiple sizes and a precise airflow control system. It supports multi-stage heating and programmable temperature profiles, helping reduce the risk of thermal deformation in electronic components.
Several competitors reported that the series delivers uniform hot-air distribution and rapid soldering iron temperature recovery, significantly improving operational efficiency and yield in chip balling and fine-pitch soldering applications.
A Comprehensive Product Lineup for Diverse Applications
Other newly showcased products addressed a broad range of application needs:
• BK212 Multifunctional Soldering Station: Equipped with a high-frequency eddy-current heating system, it heats up to 350°C in just 8 seconds, making it ideal for efficient everyday consumer electronics repair.
• BK210MX Portable Soldering Iron: Featuring a built-in lithium battery and USB Type-C fast charging, it provides over two hours of continuous operation on a full charge. Its lightweight design makes it well suited for outdoor and on-site repair work.
• BK261mini Desktop Fume Extractor: With a footprint approximately one-third that of conventional products, it combines three-stage filtration with a low-noise fan to efficiently capture and filter soldering fumes.
• BGA Rework System: Featuring an upgraded optical alignment module and a multi-stage heating platform, it supports precision chip-level rework on large circuit boards.
The exhibition attracted strong interest, with procurement and technical representatives from repair service chains and electronics manufacturers visiting the booth for consultations and technical exchanges. Several organizations expressed interest in pursuing cooperation during the event.
Next Stop: NEPCON ASIA, Featuring BAKON’s Full Product Portfolio
Following the successful conclusion of the CGC World Cup, BAKON is moving from the specialized repair arena to the broader electronics manufacturing industry, marking the next major milestone in its 2026 exhibition schedule.
From October 27 to 29, 2026, NEPCON ASIA will take place at the Shenzhen World Exhibition & Convention Center. As a leading exhibition for Asia’s electronics manufacturing industry, the event will bring together more than 600 leading suppliers from around the world, covering key sectors including PCB assembly, semiconductor packaging and testing, smart factories, and automotive electronics.
BAKON will present a comprehensive product portfolio spanning the entire manufacturing process, from R&D and prototyping to mass production, maintenance, and rework. In addition to the BK2601 Series desoldering stations, which earned recognition at the CGC competition, and its full range of soldering tools, BAKON will showcase integrated ESD control solutions for SMT production lines, automated soldering equipment for high-volume manufacturing, and industrial-grade fume extraction systems.
Through live demonstrations, technical presentations, and customized solution consultations, BAKON will highlight its expertise across four core areas: precision soldering, intelligent screwdriving, ESD control, and automation. In doing so, the company will demonstrate its commitment to providing end-to-end manufacturing support and helping electronics manufacturers improve quality and operational efficiency.
BAKON warmly invites industry professionals and partners to visit its booth at NEPCON ASIA and explore new opportunities to advance high-quality development across the electronics manufacturing industry.